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Bid Title: 2019 Chip Seal Project
Category: Engineering & Public Works
Status: Open

Description:
ADVERTISEMENT FOR BIDS FOR
2019 CHIP SEAL PROJECT

Sealed proposals will be received at City Hall, Engineering Department, 2nd Floor, 203 Main Avenue East, Twin Falls, Idaho until 2:00 P.M., prevailing local time on May 23, 2019, at which time they shall be publicly opened and read in Conference Room 206, located on the 2nd floor, at 203 Main Avenue East.

Bids will be received for chip sealing of City streets.

Contract Documents with specifications and/or plans are available at the Engineering Department, located on the 2nd floor, at 203 Main Avenue East, Twin Falls, Idaho. There shall be a non-refundable copy fee of THIRTY-SEVEN DOLLARS AND FIFTY CENTS ($37.50). There shall be a non-refundable mailing fee of TWENTY-FIVE DOLLARS ($25.00) for bid documents that are requested to be mailed. For additional information please contact the City of Twin Falls Engineering Department at (208) 735-7248.

City of Twin Falls
203 Main Avenue East
P.O. Box 1907
Twin Falls, ID 83303-1907

Publish: May 8, 2019 & May 15, 2019
Open: May 23, 2019
Publication Date/Time:
5/8/2019 8:00 AM
Publication Information:
Publish 05-08-19 and 05-15-19
Closing Date/Time:
5/23/2019 2:00 PM

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